Pre-processing research device (chemical polishing device)
The material thickness is PI 25μm or more! We would like to introduce a device for surface treatment of both sides of copper foil.
The device is capable of performing surface treatment on both sides of copper foil. The lane configuration is 2 lanes, and the processing surfaces are single-sided and double-sided. The device configuration consists of unwinding, electro-degreasing, acid cleaning, chemical treatment, acid cleaning, pure water washing, liquid draining, drying, and winding. 【Specifications】 ■ Lane configuration: 2 lanes ■ Transport speed: 1.5m to 3.0m/min ■ Material width: For TAB/CSP/COF 35mm to 160mm (For FPC 250 to 300mm) ■ Material thickness: PI 25μm and above ■ Processing surfaces: Single-sided and double-sided *For more details, please refer to the PDF document or feel free to contact us.
- Company：SETO ENGINEERING 守谷事業所
- Price：Other
